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COB Soft Packaging of Circuit Boards
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COB Soft Packaging of Circuit Boards

1. What is COB soft package

Careful netizens may find that there is a lump of black stuff on some PCBs. What is this stuff? Why does it play a role on the PCB? In fact, it is a kind of packaging, whICh we often call "soft packaging". It is said that the soft packaging is actually for "hard", and its composition material is epoxy resin. We usually see that the receiving surface of the receiver is also this material, and its inside is a chip IC. This process is calLED "Bonding", and we usually call it "binding".


This is a wiring process in the chip production process. Its English name is COB (Chip On Board), that is, chip on board packaging. This is one of the bare chip mounting technologies. The Chip is mounted on the PCB printed PCB using epoxy resin. Why do some PCBs not have this packaging? What are the characteristics of this packaging?

2. COB Soft Package Features

This kind of soft packaging technology is often for cost. As the SIMplest bare chip mounting, in order to protect the internal IC from damage, this kind of packaging generally requires one-time molding, which is generally placed on the copper foil surface of the PCB. The shape is round and the color is black. This kind of packaging technology has the advantages of low cost, space saving, thinness, good heat dissipation, simple packaging method, etc. Many integrated circuits, Especially for most low-cost circuits, it is only necessary to lead more than one metal wire on the integrated circuit chip in this way, and then submit it to the manufacturer to put the chip on the PCB, weld it with a machine, and then glue it to harden.

3. Application occasions

Because of its unique characteristics, this packaging is also used in some electronic circuit circuits, such as MP3 players, electronic organs, digital CAMeras, game consoles, etc. In fact, COB soft packaging is not only limited to chips, but also widely used in LED. For example, COB light source is an integrated surface light source technology that is directly attached to the mirror metal substrate on the LED chip.

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