SMT patch processing needs to pay attention to several standard problems
SMT patch processing technology is also more and more widely used in various fields. However, in the process of SMT patch processing, there are some standard problems that need our special attention. These problems may affect the efficiency and quality of processing, so it is necessary to strictly comply with the relevant standards in the operation process.
The first point: size error problemhttps://www.kingfordpcb.com/yuan.php?time=1685456619
In SMT patch processing, size error is a very important standard problem. Because SMT components of different sizes need to match different process parameters. If the process parameters are not accurate, it will lead to errors in the precision of components. Therefore, it is necessary to accurately measure the size of each component to avoid errors during SMT patch processing.
The second point: component offset problem
Component offset is also a standard problem to be paid attention to during SMT patch processing. Because the component offset will make the entire circuit board wiring error, resulting in the circuit board electrical performance problems. Therefore, in the process of operation, it is necessary to ensure that the position of each component is correct, and maintain a certain distance from the previously arranged components to avoid component deviation.
The third point: temperature control
In SMT patch processing, temperature control is also an important standard problem. Because the heating temperature is not correct, it will lead to the component welding is not strong, thus affecting the service life of the circuit board. Therefore, during SMT patch processing, the temperature should be controlled in the operation process to avoid too high or too low temperature to ensure that the components can be completely welded.
Fourth point: PCB board surface treatment problem
In SMT processing, PCB surface treatment is also a standard problem that needs attention. Due to incomplete treatment of PCB surface, the contact area between components and PCB board will become smaller, affecting the welding quality. Therefore, in the process of PCB board surface treatment, it is necessary to pay attention to cleanliness, avoid surface pollution, oxidation and corrosion problems, to ensure that the PCB board surface treatment is complete.
The above are SMT patch processing need to pay attention to a few standard problems. During SMT patch processing, these standards should be strictly followed to ensure the stability and reliability of machining quality. In addition, we also need to learn and master the relevant knowledge of SMT patch processing technology, so as to continuously improve our comprehensive processing ability and level.