Maintenance of SMT processing parts

Maintenance of SMT processing parts
Chip resistors, capacitors, and inductors are commonly referred to as surface mount chip assemblies For rework of wafer components, ordinary anti-static electric soldering iron can be used, or special clip soldering iron can be used to heat both ends at the same time Wafer module rework surface mounting is the simplest Chip modules are usually small, so when heating them, the temperature must be controlled correctly, otherwise excessive temperature will damage the components During heating, the soldering iron usually stays on the pad for no more than 3 seconds The core surface mounting process flow of its is: chip assembly desoldering and disassembly, pad cleaning, assembly and welding
What kind of surface mounting process is used for the maintenance of common components in?
1. Soldering and disassembly of wafer assembly
(1) If the component is coated, the coating shall be removed first, and then the residue on the working surface shall be removed.
(2) Install a hot clamping soldering iron head with proper shape and size in the hot clamping tool.
(3) Set the temperature of the soldering head to about 300 RON, which can be changed appropriately as required.
(4) Apply flux to the two solder joints of the wafer assembly.
(5) Use a wet sponge to remove oxides and residues from the tip of the soldering iron.
(6) Place the soldering iron head on the top of the wafer assembly, and clamp both ends of the assembly to contact the solder joint.
(7) When the solder joints at both ends are completely melted, lift the component.
(8) Place the removed components in a heat-resistant container.
Surface mounting 6
What is the maintenance of common components in surface mount machining?
Circuit board

2. Cleaning of base plate
(1) Select the chisel tip and set the temperature to about 300 rpm, which can be changed as required.
(2) Brush flux on the bonding pad of the circuit board.
(3) Use a wet sponge to remove oxides and residues from the tip of the soldering iron.
(4) Put a soft tin absorption braided tape on the bonding pad, which has good solderability.
(5) Gently press the tip of the soldering iron on the tin absorbing braid. When the solder on the bonding pad melts, slowly move the tip of the soldering iron and the braid to remove the residual solder on the bonding pad.
What is the maintenance of common components in surface mount machining?
3. Assembly and welding of wafer modules
(1) Select a soldering head with proper shape and size.
(2) The temperature of the tip of the soldering iron is set to about 280 Y, which can be changed appropriately as required.
(3) Brush flux on the two pads of the circuit board
(4) Use a wet sponge to remove oxides and residues from the tip of the soldering iron.
(5) Apply a proper amount of solder on the bonding pad with an electric soldering iron.
(6) Clamp the chip assembly with a soldering iron, and connect one end of the assembly to the welding pad to fix the assembly.
(7) Use a soldering iron and welding wire to weld the other end of the component to the pad.
(8) Weld both ends of the assembly to the pad.

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