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How does PCBA dissipate heat during PCB manufacturing?
01Dec
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How does PCBA dissipate heat during PCB manufacturing?

How does PCBA dissipate heat during PCB manufacturing?
Heat generated during operation Polychlorinated biphenyl technology equipment The manufacturer of polychlorinated biphenyls will cause the internal temperature of the equipment to rise rapidly If the heat is not dissipated in time, the equipment will continue to rise, the PCB on the equipment will become invalid due to overheating, and the reliability of electronIC equipment will decline; Therefore, the board of directors for heat dissipation treatment of PCBs is a very important work link
1. Analysis of PCB board temperature rise factors: The direct cause of PCB board temperature rise is the existence of circuit power consumption devices, electronIC components will have varying degrees of power consumption, and the heating intensity varies with the power consumption. Two kinds of temperature rise phenomena of PCB: (1) local temperature rise or large area temperature rise; (2) Short time temperature rise or long time temperature rise.
When analyzing the heat power consumption of polychlorinated biphenyls, it is usually necessary to analyze from the following aspects: 1. Power consumption (1) analyze the power consumption of the organization area; (2) The power consumption distribution of PCB is analyzed. 2. printed board structure (1) Printed board size; (2) Printed board information.

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Analyzing the above factors from polychlorinated biphenyls is an effective way to solve the PCB temperature rise. Usually, these factors are interrelated and dependent in products and systems. Most factors should be analyzed according to the actual situation. The parameters such as temperature rise and power consumption can be calculated or estimated correctly only according to specific actual conditions.
Polychlorinated biphenyls
2. Cooling mode circuit board:
1. Radiator and heat conduction plate with high heating elements: when several elements in the PCB have large heating capacity (less than 3.), a radiator or heat conduction tube can be added to the PCB elements. When the temperature cannot be reduced, the radiator with fan can be used to enhance the cooling effect. When there are multiple polychlorinated biphenyl heating devices (more than 3), large heat dissipation covers (plates) can be used. This is a special radiator customized according to the position and height of the heating device on the polychlorinated biphenyl plate, or different component height positions can be pulLED out on the large flat panel radiator; The heat dissipation cover is buckled on the surface of the component as a whole and contacts with each component for heat dissipation. However, due to the poor consistency of components during assembly and welding, the heat dissipation effect is poor. Generally, a soft thermal phase change heat conduction pad is added on the surface of the PCB element to improve the heat dissipation effect.
3. Heat dissipation through PCBs: At present, PCBs widely used by PCBs manufacturers are copper clad plate/epoxy glass cloth substrate or phenolic resin glass cloth substrate, while a few PCBs manufacturers use paper based copper clad plate; Although these substrates have good power and processing efficiency, they have poor heat dissipation. As the heat dissipation path of high heat element, the resin of polychlorinated biphenyl itself is almost impossible to transfer heat, but the heat radiates from the surface of polychlorinated biphenyl plate element to the surrounding air. However, as electronic products enter the era of miniaturization, high-density installation and high heat assembly of components, it is not enough to dissipate heat only on the surface of components with very SMAll PCBs. At the same time, due to the extensive use of surface mounted components such as QFP and BGA, a large amount of heat generated by the components is transferred to the PCB plate. In this regard, the best way to solve the problem of heat dissipation is to improve the heat dissipation capacity of PCB which is in direct contact with the heating elements. The heating elements are transmitted or distributed through PCB.
4. polychlorinated biphenyl workshop of polychlorinated biphenyl manufacturer must adopt rational wiring design to realize heat dispersion: since the thermal conductivity of resin in most polychlorinated biphenyl plates are very poor, copper foil wire and copper foil hole are good heat conductors, and main means of heat dispersion of polychlorinated biphenyl technology polychlorinated biphenyl manufacturer is to improve the residual rate of copper foil and increase heat production holes; When evaluating the heat dispersion capacity of polychlorinated biphenyls, polychlorinated biphenyls science and technology engineers need to calculate that polychlorinated biphenyls are composed of various materials with different thermal conductivity by using the equivalent thermal conductivity (nine EQ) of insulating substance

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