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Hybrid PCB
RO4350B+FR4 high frequency hybrid plate

RO4350B+FR4 high frequency hybrid plate

Name: RO4350B+FR4 high frequency hybrid plate

Plate: Rogers RO4350B+FR4

Layers: 4L

board ThICkness: 1.6MM

Copper thickness: finished copper thickness 1OZ

Impedance: 50 ohm

Medium thickness: 0.508MM

Dielectric Constant : 3.48

Thermal conductivity: 0.69w/m.k

Flame retardant grade: 94V-0

Volume resistivity: 1.2*1010

Product Details Data Sheet

Rogers RO4350B PCB material is a strengthened glassy hydrocarbon/ceramIC material that can be processed in the same way as low cost printed circuits on FR-4 substrate material. Its dielectric constant at 10 GHz is 3.48, which makes it commonly used in high frequency power amplifier designs. The ro4350b laminate has a low coefficient of thermal expansion (CTE) along the z-axis, ensuring high stability for Multilayer circuits interconnected through metallized vias (PTH).

Name: RO4350B+FR4 high frequency hybrid plate

Plate: Rogers RO4350B+FR4

Layers: 4L

board ThICkness: 1.6MM

Copper thickness: finished copper thickness 1OZ

Impedance: 50 ohm

Medium thickness: 0.508MM

Dielectric Constant : 3.48

Thermal conductivity: 0.69w/m.k

Flame retardant grade: 94V-0

Volume resistivity: 1.2*1010

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