RO4350B+FR4 high frequency hybrid PCB
Name: RO4350B+FR4 high frequency hybrid PCB board
Plate: Rogers RO4350B+FR4
Layers: 4L
Board Thickness: 1.6MM
Copper thickness: finished copper thickness 1OZ
Impedance: 50 ohm
Medium thickness: 0.508MM
Dielectric Constant : 3.48
Thermal conductivity: 0.69w/m.k
Flame retardant grade: 94V-0
Volume resistivity: 1.2*1010
Rogers ro4350b PCB board material is a strengthened glassy hydrocarbon/ceramic material that can be processed in the same way as low cost printed circuits on FR-4 substrate material. Its dielectric constant at 10 GHz is 3.48, which makes it commonly used in high frequency power amplifier designs. The ro4350b laminate has a low coefficient of thermal expansion (CTE) along the z-axis, ensuring high stability for multilayer circuits interconnected through metallized vias (PTH).
Name: RO4350B+FR4 high frequency hybrid PCB board
Plate: Rogers RO4350B+FR4
Layers: 4L
Board Thickness: 1.6MM
Copper thickness: finished copper thickness 1OZ
Impedance: 50 ohm
Medium thickness: 0.508MM
Dielectric Constant : 3.48
Thermal conductivity: 0.69w/m.k
Flame retardant grade: 94V-0
Volume resistivity: 1.2*1010
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