FAQ

Yes! You can rely on our BGA rework services to ensure optimum performance.

For BGA printed circuit board assembly, we have strict testing protocols including: X-ray inspection, functional testing, automated optical inspection.

Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)

Some of the factors that affect BGA assembly quality include checking laminate compatibility, warpage requirements, surface finish effects, solder mask clearance, etc.

BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.

We have our own PCB and SMT processing factory, which can meet customers' one-stop service from design to proofing

Generally 3-5RMB/PINS. This price provides invoices, contracts, nondisclosure agreements, and more. The specific needs to be evaluated according to the difficulty of the product

Generally 3-5RMB/PINS. This price provides invoices, contracts, nondisclosure agreements, and more. The specific needs to be evaluated according to the difficulty of the product

Design data output: PCB source files, Gerber files, assembly files, stencil files, structural files, etc.

The customer needs to provide information: schematic diagram, netlist, structure diagram, device information for the new library, design requirements, etc.

Design specifications, design instructions, customer design requirements and related CHECKLIST, and provide layout files and structure files for customers to conduct layout review; customers confirm the rationality of the layout, stacking scheme, impedance scheme, structure, package, and confirm the wiring parameters