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Multilayer thick copper plate
Name: Multilayer thick copper plate
Material: Shengyi FR-4 TG170
Layers: 10 layers
Minimum aperture: 1.2mm
Plate thickness 3.2±0.25mm
Minimum copper thickness: 60μm
Surface Treatment: Immersion Gold
Copper thickness of inner and outer layers: 160μm
Process features: high multi-layer, thick copper, high TG
Product Details
Data Sheet
The product is used in small base station power supply, the copper thickness in the hole is 70um, the resin plug hole is filled with resin, the inner layer copper thickness is 4oz, and the outer layer copper thickness is 3oz.
Name: Multilayer thick copper plate
Material: Shengyi FR-4 TG170
Layers: 10 layers
Minimum aperture: 1.2mm
Plate thickness 3.2±0.25mm
Minimum copper thickness: 60μm
Surface Treatment: Immersion Gold
Copper thickness of inner and outer layers: 160μm
Process features: high multi-layer, thick copper, high TG
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