The silk screen position number does not determine whether the final patch is correct. Many experienced engineers found that deleting the bit number silk screen printing, PCBA product patch back and no problem. Generally, the machine patch locates the dev
Printed circuit board PCB copper wire off bad, PCB factories are said to be laminate problems, requiring its production factory to bear bad losses.
In PCBA manufacturing, automatic optical detection is set at the last step of the SMT production line. After the SMT patch processing is completed, product defect detection is required. Through timely detection and reduction of defects, improve assembly e
Circuit diagram, also known as circuit schematic diagram, is a kind of drawings reflecting the electrical connection of each component of electronic equipment. The circuit diagram consists of some abstract symbols, according to certain rules.
Modern PCBA electronic assembly is a complex process, in the process of production, due to PCB substrate, PCB board processing process factors lead to PCB defects.
The welding methods of PCBA: (1) split welding method: (2) centralized welding method: (3) residual welding method: (4) shear welding method
The design of PCB starts from determining the size of the board. The size of PCB is limited by the size of the case shell, so that it can be placed into the shell exactly. Secondly, the connection mode of PCB and external components should be considered.
Solutions to impedance discontinuity problems in PCB design: 1. Gradient line, 2. Corner, 3. Large pad, 4. Through hole, 5. Through hole coaxial connector
The closed physical border is a basic platform for future component layout and wiring, and also a constraint on automatic layout. Corner place best use arc, on the one hand can avoid sharp Angle scratch workers, but also can reduce the stress effect.
As an electronic engineer design circuit is a necessary hard work, if the PCB design is not reasonable performance will be greatly compromised.
Four difficulties in the production and processing of multilayer circuit board: 1, the inner line production difficulties, 2, the inner layer between the point of difficulty, 3, pressing process difficulties, 4, drilling production difficulties
SMT patch BOM list arrangement Note: 3. The description must be clear. 4. There are some crucial electronic components. Considering the fluctuations of the component market and the cost, 5. 6. Coordinate values required by coordinate T/B to distinguish po
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