The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second l
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second l
4-layer HDI PCB is widely used in:Telecom modulewireless moduleLED display moduleHDI PCB (1+N+1): This is the simplest HDI PCB layout design structure, suitable for BGAs with fewer I/Os. It features fine lines, micro vias, and registration technology capa
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