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Rigid Flex PCB Design
HDI Rigid-Flex PCB Layout & Design

HDI Rigid-Flex PCB Layout & Design

Name: HDI Rigid-Flex PCB layout & design

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

Product Details Data Sheet

What is HDI PCB?

High Density Interconnect (HDI) is SIMply a PCB with a higher number of interconnects in the smallest footprint. This leads to miniaturization of the circuit board. components are placed closer together and board space is signifICantly reduced, but functionality is not compromised.

More precisely, a PCB with an average of 120 to 160 pins per square inch is considered an HDI PCB. HDI designs combine dense component placement and versatile routing. HDI popularized microporous technology. Create denser circuits by implementing microvias, buried vias, and blind vias. Reduced drilling of copper in HDI designs.

What are the advantages of HDI PCB?

Extraordinary Versatility: HDI boards are ideal when weight, space, reliability and performance are the main concerns.

Compact design: The combination of blind, buried and micro vias reduces board space requirements.

Better Signal Integrity: HDI utilizes via-in-pad and blind via technology. This helps keep components close to each other, reducing signal path lengths. HDI technology removes through-hole stubs, thus reducing signal reflections, thereby improving signal quality. Therefore, it significantly improves signal integrity due to shorter signal paths. 

 High reliability: The implementation of stacked vias makes these boards a super barrier against extreme environmental conditions.

 Cost-effective: The functionality of a standard 8-layer through-hole board (standard PCB) can be reduced to a 6-layer HDI board without compromising the quality.

Name: HDI Rigid-Flex PCB layout & design

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

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