Thermoelectric separation copper-based circuit board

Copper PCB thermal electricity separation process technical steps

1. First cut the copper foil substrate into a suitable size for processing.

2. Note that in front of the pressure plate, the copper foil on the copper surface needs to be roughly treated by bristles, micro erosion and other methods.

3. Dry membrane photoresal adhesion is adhesive to the copper core PCB under the appropriate temperature and pressure. The photoresal glue is in the light transmittance area of the film (the dry membrane of the area will be retained in the subsequent shaped copper etching steps. Stop.), The line images on the film will be transferred to the dry membrane light glue on the plate.

4. After tearing off the protective film on the surface of the film, use sodium carbonate solution to remove the sharing of the unre exposed area of the film surface with sodium carbonate solution. Then use the hydrochloric acid and hydrogen peroxide to remove the exposed copper foil to form a line.

5. Finally, wash with a sodium hydroxide water solution and remove the scrapped dry membrane photoresal glue. For the inner circuit board with more than six layers, use automatic positioning punching machines out of the riveting benchmark holes for inter -layer lines