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Metal Core PCB
Metal Core PCB
High thermal conductivity copper substrate

High thermal conductivity copper substrate

Name: High thermal conductivity copper substrate

Plate thickness: 1.0MM

Copper foil thickness: 2OZ

Withstand voltage: AC2000V

Thermal conductivity: 398w/m.k

Solder mask type: black oil

Surface Treatment: Immersion Gold

E-T test: 100% computer open and short test

Production process: thermoelectric separation process

Product Details Data Sheet

The substrate thermal conductivity can be found in the test instruments after the plate is pressed. The high thermal conductivity is generally ceramic, aluminum, etc., but due to the cost of cost, most of the previous market is copper -based plates. The substrate thermal conductivity is a parameter that everyone cares about. The higher the thermal conductivity, the better the significant sign of the representative performance. The copper base plate is a unique metal -based copper plate, which has good thermal conductivity, electrical insulation performance and mechanical processing performance.

Name: High thermal conductivity copper substrate

Plate thickness: 1.0MM

Copper foil thickness: 2OZ

Withstand voltage: AC2000V

Thermal conductivity: 398w/m.k

Solder mask type: black oil

Surface Treatment: Immersion Gold

E-T test: 100% computer open and short test

Production process: thermoelectric separation process

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.