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Update iteration depth of 5 major PCB substrates
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Update iteration depth of 5 major PCB substrates

As PCB substrate, copper clad plate (CCL), as the substrate material in PCB manufacturing, mainly plays the role of interconnection, insulation and support for PCB, and has a great impact on signal transmission speed, energy loss and characteristic impedance in the circuit. Therefore, the performance, quality, manufacturability, manufacturing level, manufacturing cost and long-term reliability and stability of PCB depend on the copper clad plate material to a large extent. Next, I will list five PCB substrates frequently used by PCB manufacturers in detail.

A, lead-free compatible copper-clad substrate

At the European Union meeting of October 11, 2002, two "European directives" on environmental protection were approved. They will be fully implemented as of July 1, 2006. The two "European Directives" refer to the "Waste of Electrical and Electronic Products Directive "(WEEE) and the" Restriction Order on the Use of Certain Hazardous Substances "(RoHs). In these two statutory directives, it is clearly mentioned to prohibit the use of materials containing lead. Therefore, the development of lead-free copper cladding as soon as possible is the best way to deal with these two directives.

Two, high performance copper clad plate

The high performance copper clad plates referred to here include low dielectric constant (Dk) copper clad plates, copper clad plates for high frequency and high speed PCB, copper clad plates with high heat resistance, various substrate materials for lamination multilayer plates (resin-coated copper foil, organic resin film forming the insulation layer of lamination multilayer plates, glass fiber reinforced or other organic fiber reinforced semi-cured sheets, etc.). In the next few years (up to 2010), the corresponding performance targets should be achieved in the development of this type of high performance copper-clad sheet, based on the predicted future development of electronic installation technology.

PCB board

Three, IC seal loading plate substrate material

It is a very important topic to develop the substrate material used for IC sealing loading plate (also known as IC packaging substrate). It is also an urgent need to develop IC packaging and microelectronic technology. With the development of IC packaging to high frequency, low energy consumption direction, IC packaging substrate in low dielectric constant, low dielectric loss factor, high thermal conductivity and other important performance will be improved. An important topic for future research and development is the thermal connection technology of substrate - effective thermal coordination and integration of heat escape etc.

Four, with special functions of copper coated plate

The copper clad plates with special functions referred to here mainly refer to metal base (core) copper clad plates, ceramic base copper clad plates, high dielectric constant plates, copper clad plates (or substrate materials) for embedded passive component type multilayer plates, copper clad plates for light-wire subgrade boards, etc. To develop and produce this kind of copper clad plate is required not only for the development of new technology of electronic information products, but also for the development of aerospace and military industry.

Five, high performance flexible copper clad plate

Flexible printed circuit board (FPC) has experienced more than 30 years of development since its industrial production. In the 1970s, the FPC began to enter truly industrial mass production. In the late 1980s, due to the emergence and application of a new polyimide film material, FPC appeared non-adhesive type FPC(generally referred to as "two-layer FPC"). In the 1990s, the world developed the sensitive covering film corresponding to the high density circuit, so that the design of FPC has a great change. Due to the opening up of new application areas, the concept of its product form has changed a little, which extends it to include TAB, COB with a larger range of substrate. In the second half of the 1990s, the high density FPC began to enter large-scale industrial production. Its circuit pattern, the rapid development to a finer degree. Demand for high-density FPCS is also growing rapidly.

To know, PCB substrate production and development is synchronized with the current electronic technology PCB industry. Therefore, in the era of rapid development of the electronic industry, the update of the base material version is particularly important.

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