With the development of electronIC industry, the integration of electronIC components is getting higher and higher, and the volume is getting SMAller and smaller, and BGA type packaging is widely used. Therefore, PCB lines will become smaller and smaller, with more and more layers. To reduce the line width and line spacing is to use the limited area as much as possible, and to increase the number of layers is to use space. The mainstream of the circuit board in the future is 2-3 mil or less.
Single sided circuit board: It is generally believed that the production of circuit boards must be invested once every time they are increased or upgraded, and the investment capital is large. In other words, high-end PCB is produced by high-end equipment. However, not every enterprise can afford the large-scale investment, and it will take a lot of time and money to conduct tests and collect process data after the investment. For example, it seems a better method to conduct experiments and trial production according to the current situation of the enterprise, and then decide whether to invest according to the actual situation and MARKet conditions. This paper describes in detail the limit of the width of thin lines that can be produced under the condition of ordinary equipment, as well as the conditions and methods for the production of thin lines.
The general production process can be divided into cover hole etching method and pattern electroplating method, both of which have advantages and disadvantages. The circuit obtained by acid etching method is very uniform, which is conducive to impedance control and less environmental pollution. However, if there is a hole, it will be scrapped; Alkali corrosion production control is relatively easy, but the line is uneven and the environment is polluted.
Precision multilayer circuit board:
The wire of precision multilayer pcb circuit board is refined and the through-hole is miniaturized, which improves the requirements for the processing equipment and process control level of pcb processing plants, and also tests the overall management ability of precision multilayer PCB circuit board plants and the personal ability of employees. The production capacity of 6/6mil line width/line distance is not too difficult within the current equipment, materials and process control level, and most PCB manufacturers can make it. However, it is a big leap from 6/6mil to 5/5mil, which makes many small and medium-sized manufacturers sigh. It seems SIMple, but in fact, it requires that PCB manufacturers have strong technical research and development capabilities and financial strength. Subject to the performance parameters of the exposure machine, the processing ability of the etching line, and the control ability of the whole process, the overall strength of the factory is required to support the 5/5mil line and maintain a high yield. Similarly, the same is true for the fabrication of finished hole diameters of 0.3mm and below (holes of 0.3mm and below cannot be drilLED by machine, and are generally laser drilled).
2. Other problems commonly encountered by PCB manufacturers, such as copper free holes, green oil peeling, BGA black PAD of gold plate, solderability, etc., should be different from each other. However, as a special process product, PCB combines various traditional technologies and means such as machinery, electrical control, automation, chEMIstry, biology, ERP, cost, management, environmental protection, etc. It requires managers to give play to great wisdom, and employees to carry forward great SPIrit, so as to strive to control every detail and maximize their quality control ability and level.
3. Effectiveness assurance of process inspection. As the carrier of all electronic components, PCB reliability is very important. A small hair and a small dust may cause the whole PCB to be scrapped, or lead to potential failure hazards. How is the quality guaranteed? It is generally believed that quality should be produced, but it is not. If a PCB factory can adjust, control and prevent common quality problems from the perspective of effective quality control at the beginning of design, including factory layout, determination of process flow, selection of production equipment, manpower allocation, effective evaluation of raw materials, determination of management system, etc., and fully consider improving production efficiency, The future quality control ability and production capacity of this factory will have a good foundation and guarantee. If the design work is well done, that is, the source is well controlled and the foundation is laid, will the next work be much easier? This is the most effective way to control PCB production process and improve quality.
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