How to solve the after-sales problems of PCBA processing quality
PCBA processing is to connect various electronic components on PCB board through surface mount (SMT), plug-in (DIP) and other electronic assemblies. PCBA process flow mainly includes SMT, AOI, DIP, FCT testing and other processes. Due to the size difference of electronic components, there will be different processes and requirements in assembly and insertion. The assembly density of PCBA is relatively high, and the small size and light weight of electronic products also have certain changes and requirements in mounting. The reliability, seismic resistance and excellent weldability of the products have high requirements for the hardware and software facilities of PCBA processing.
Many customers are concerned about the after-sales of PCBA processing. How to ensure that the PCBA boards received meet the quality requirements? First of all, the customer will cooperate with the PCBA factory to design a test plan to ensure that 100% of PCBA boards are tested before delivery; Secondly, after receiving the boards, the customer also needs to conduct spot check one by one according to the acceptance details in the industry standard IPC-A-610E, so as to meet the receiving standard. As for the warranty period, the quality and process of many PCBA boards are very mature. Under normal use conditions, the warranty period is 1-3 years. For very few PCBA boards that need to be used in harsh environments, the service life may be different.
In order to ensure after-sales problems, a quality assurance agreement can be signed between the customer and PCBA factory, so that both parties can have a clear definition of specific details and avoid unnecessary disputes. In addition, the core to eliminate after-sales concerns is to find a very professional PCBA electronic manufacturing service provider, because a higher level of process can ensure the stability of PCBA boards, thus increasing the service life. What is more valuable is that professional electronic manufacturers can help improve the manufacturability of DFM, optimize PCB design and gradually reduce costs.