10-layer 3-stage HDI PCB
Name: 10-layer 3-stage HDI PCB
Layers: 3+4+3
Sheet: FR4 Tg170
Plate thickness: 1.2mm
Panel size: 126*118mm/4
Outer copper thickness: 35μm
Inner layer copper thickness: 18μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.25mm
Line width and spacing: 2.8/3.2mil
Surface Treatment: Immersion Gold 2μ''+OSP
Technical features:
50 Ω Antenna, 90Ω & 100Ω Differential Impedance
application：
Cell Phones, Tablets, Ultrabooks, E-Readers, MP3 Players, GPS, Portable Game Consoles, DSCs, Cameras, LCD TVs, POS Terminals
HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in mobile phones, touch screen devices, laptops, digital cameras, and 4G network communications. HDI PCB also plays an important role in medical equipment as well as various electronic aircraft components. The possibilities for high-density interconnect PCB technology seem almost limitless.
Name: 10-layer 3-stage HDI PCB
Layers: 3+4+3
Sheet: FR4 Tg170
Plate thickness: 1.2mm
Panel size: 126*118mm/4
Outer copper thickness: 35μm
Inner layer copper thickness: 18μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.25mm
Line width and spacing: 2.8/3.2mil
Surface Treatment: Immersion Gold 2μ''+OSP
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