PCB process production

New imported drilling rig, high load, high precision ball screw, high stability during operation.

Guaranteeing the hole-copper bonding rate can reduce the risk of the hole being free of copper.

The uniformity of copper plating is over 99%, ensuring the quality of copper plating.

High accuracy of alignment and imaging, higher parallel depth of field.

Prevents non-soldered points from being stained with solder, which is convenient for SMD packaging.

Digital printing, multi-head technology, and motion control can make the surface text clearer and more beautiful.

100% test functional open and short circuit to ensure that each piece is a good test product.

The external dimension has higher precision, the cut surface is smooth, and there is no burr.

Adopt double table independent motion design, accurate positioning, strong operation flexibility, and speed up forming.