Aluminum Core LED MC Single Sided PCB

MCPCB aluminum substrate structure

The MCPCB aluminum substrate structure consists of circuit layer (copper foil layer), thermal conductivity insulation layer, and metal grassroots. The circuit layer requires a large load capacity, so that thicker copper foil should be used, the thickness is generally 35 μm ~ 280 μm; the heat conduction layer is the core technology of the PCB aluminum substrate. It is generally a special polymer filled by special ceramics Composition, small thermal resistance, excellent adhesion, ability to resist aging and aging, and can withstand mechanical and thermal stress. The heating insulation layer of high-performance PCB aluminum substrates such as IMS-H01, IMS-H02, and LED-0601 uses this technology to make it have excellent thermal conductivity and high-intensity electrical insulation performance; The supporting components are required to have high thermal conductivity. Generally, aluminum plates can also be used, and copper plates can also be used (where copper plates can provide better thermal conductivity), which is suitable for routine mechanical processing such as drilling, flushing and cutting. The process requirements are: gold -plated, tin spray, OSP antioxidant, sinking gold, lead -free tin spray.