4-layer immersion gold FR4 impedance board
Name: 4-layer immersion gold FR4 impedance board
Substrate: Copper, FR4, High TG FR4
Copper Thickness: 0.5-4 oz, 0.5-3 oz
Plate thickness: 0.2-6mm, 0.1-4mm
minute. Hole size: T/2mm / 0.2 mm / 0.15mm or customized, 0.2mm
minute. Line width: 0.15mm / 0.1mm or customized, 0.075mm
minute. Line spacing: 0.15mm/0.1mm/4mil or customized, 0.075mm
Surface treatment: spray tin, immersion gold, flash gold, silver plating, OSP, spray tin, immersion silver, immersion tin, OSP
Layers: 8 layers
The production material of the impedance circuit board is the FR4 of the TG 150. It adopts a four -layer structure design and has impedance requirements. The copper thickness 1oz is completed. The circuit board is used in the field of digital equipment.
Name: 4-layer immersion gold FR4 impedance board
Substrate: Copper, FR4, High TG FR4
Copper Thickness: 0.5-4 oz, 0.5-3 oz
Plate thickness: 0.2-6mm, 0.1-4mm
minute. Hole size: T/2mm / 0.2 mm / 0.15mm or customized, 0.2mm
minute. Line width: 0.15mm / 0.1mm or customized, 0.075mm
minute. Line spacing: 0.15mm/0.1mm/4mil or customized, 0.075mm
Surface treatment: spray tin, immersion gold, flash gold, silver plating, OSP, spray tin, immersion silver, immersion tin, OSP
Layers: 8 layers
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