Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".
FAQ
FAQ
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What are your BGA assembly capabilities?

Our BGA printed circuit board capabilities cover the following: MICro Ball Grid Array (µBGA), Thin chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)

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