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The severe shrinkage of PCB parts after the transfer of the outer pattern caused by the poor dimensional stability of PCB substrates in individual batches can only be detected by the measurement of the outer pattern production first plate or during the sh
By analyzing the causes of PCB size increase and contraction, we can find out the available monitoring and improvement methods.
The PCB processing process from the inner line pattern transfer of PCB substrate to the outer line pattern transfer by pressing several times will cause different growth and contraction of the warp and weft of the jointed board.
With the 3D capabilities of the layout tool, designers can interactively handle their component placement in real time and correct all clearance errors in the design's mechanical features.
This article is about the reason and analysis of PCB size expansion and contraction in PCB processing