| Capacity |
|
| Single and double sided SMT/PTH |
Yes |
| Large parts on both sides, BGA on both sides |
Yes |
| Smallest Chips size |
201 |
| Min BGA and Micro BGA pitch and ball counts |
0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| Min Leaded parts pitch |
0.008 in. (0.2 mm) |
| Max Parts size assembly by machine |
2.2 in. x 2.2 in. x 0.6 in. |
| Assembly surface mount connectors |
Yes |
| Odd form parts: |
Yes，Assembly by hands |
| LED |
| Resistor and capacitor networks |
| Electrolytic capacitors |
| Variable resistors and capacitors (pots) |
| Sockets |
| Wave soldering |
Yes |
| Max PCB size |
14.5 in. x 19.5 in. |
| Min PCB Thickness |
0.02 |
| Fiducial Marks |
Preferred but not required |
| PCB Finish: |
1．SMOBC/HASL |
| 2．Electrolytic gold |
| 3．Electroless gold |
| 4．Electroless silver |
| 5．Immersion gold |
| 6．Immersion tin |
| 7．OSP |
| PCB Shape |
Any |
| Panelized PCB |
1．Tab routed |
| 2．Breakaway tabs |
| 3．V-Scored |
| 4．Routed+ V scored |
| Inspection |
1．X-ray analysis |
| 2．Microscope to 20X |
| Rework |
1．BGA removal and replacement station |
| 2．SMT IR rework station |
| 3．Thru-hole rework station |
