Capacity |
|
Single and double sided SMT/PTH |
Yes |
Large parts on both sides, BGA on both sides |
Yes |
Smallest Chips size |
201 |
Min BGA and Micro BGA pitch and ball counts |
0.008 in. (0.2mm) pitch, ball count greater than 1000 |
Min Leaded parts pitch |
0.008 in. (0.2 mm) |
Max Parts size assembly by machine |
2.2 in. x 2.2 in. x 0.6 in. |
Assembly surface mount connectors |
Yes |
Odd form parts: |
Yes,Assembly by hands |
LED |
Resistor and capacitor networks |
Electrolytic capacitors |
Variable resistors and capacitors (pots) |
Sockets |
Wave soldering |
Yes |
Max PCB size |
14.5 in. x 19.5 in. |
Min PCB Thickness |
0.02 |
Fiducial Marks |
Preferred but not required |
PCB Finish: |
1.SMOBC/HASL |
2.Electrolytic gold |
3.Electroless gold |
4.Electroless silver |
5.Immersion gold |
6.Immersion tin |
7.OSP |
PCB Shape |
Any |
Panelized PCB |
1.Tab routed |
2.Breakaway tabs |
3.V-Scored |
4.Routed+ V scored |
Inspection |
1.X-ray analysis |
2.Microscope to 20X |
Rework |
1.BGA removal and replacement station |
2.SMT IR rework station |
3.Thru-hole rework station |