SMT Capability

CAPABILITIES-3
Capacity
Single and double sided SMT/PTH Yes
Large parts on both sides, BGA on both sides Yes
Smallest Chips size 0201
Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000
Min Leaded parts pitch 0.008 in. (0.2 mm)
Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in.
Assembly surface mount connectors Yes
Odd form parts: Yes,Assembly by hands
LED
Resistor and capacitor networks
Electrolytic capacitors
Variable resistors and capacitors (pots)
Sockets
Reflow soldering Yes
Max PCB size 14.5 in. x 19.5 in.
Min PCB Thickness 0.2
Fiducial Marks Preferred but not required
PCB Finish: 1.SMOBC/HASL
2.Electrolytic gold
3.Electroless gold
4.Electroless silver
5.Immersion gold
6.Immersion tin
7.OSP
PCB Shape Any
Panelized PCB 1.Tab routed
2.Breakaway tabs
3.V-Scored
4.Routed+ V scored
Inspection 1.X-ray analysis
2.Microscope to 20X
Rework 1.BGA removal and replacement station
2.SMT IR rework station
3.Thru-hole rework station

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