Development of China's Copper Clad Laminate Industry

PCB     |      2021-10-14 09:33

Table of Content

1.Development history of China’s copper clad laminate industry

2.Copper Clad Laminate Industry development trend

3.Seven out of ten of the global CCL output value comes from China

 

1.Development history of China’s copper clad laminate industry

Copper clad laminate is the raw material for manufacturing PCB, and its development history is related to the development of the PCB industry. Throughout the world, the development of the copper clad laminate industry has a history of hundreds of years. The development history of copper clad laminates and non-mainstream In the 50s of the last century, if the stages are carried out in stages, it can be developed into four stages.

The first stage (1955-1978) was the initial stage, during which the development of my country’s electronics industry was slow, and the demand for copper clad laminates was relatively small. Therefore, the overall level of PCB manufacturing plants was not high, and the technical requirements were relatively low. Important historical events during this period included the creation of the CCL process by the Institute of Radio Technology in 1955, and the development of epoxy glass fiber cloth-based copper clad laminates with acid anhydride as curing agent by the 15 Institute of the Fourth Machinery Department in 1960. The annual output of my country’s copper clad laminates in 1978 For the first time, it broke the 1,000-ton scale and reached 1,500 tons.

In the second stage (1979-1985), the level of research and production of multilayer laminates in China has improved. In 1980, Sichuan Glass Fiber Factory took the lead in developing glass cloth for copper clad laminates with thicknesses of 0.1mm and 0.14mm. .

The third stage (1986-1994) large-scale production stage, several domestic copper clad laminate companies have gradually completed the introduction of foreign copper clad laminate manufacturing equipment and technology, and entered large-scale production; the gap between the technical level and foreign countries has gradually narrowed. In 1991, the CCL Industry Association was established. In 1993, my country independently developed CEM-1 and CEM-3 composite base CCL.

In the fourth stage (from 1995 to present), my country’s CCL industry has developed rapidly and has become the country with the highest output and consumption in the world. CCL manufacturers from all over the world are focusing their attention on China. In 2010, a number of CCL factories launched newly developed high thermal conductivity copper clad laminates at the CPCA exhibition held in Shanghai.

 

2.Copper Clad Laminate Industry development trend

2017 is a very prosperous year for most electronics companies, including the PCB industry. There are two main driving factors. One is that iPhone 8 and iPhone X have created many industrial chains to stimulate equipment and material suppliers to support the HDI industrial chain structure. For the PCB industry, mobile phones are a very important support point, especially Apple mobile phones using the most advanced manufacturing technology is pushing the entire industry forward. For example, due to the increase in the internal components of the Apple mobile phone, in the thickness of 7.7 mm, it is necessary to install a display screen, but also to configure a large number of parts such as sensors and heat sinks. Therefore, the requirements for the thickness of the PCB are naturally becoming more and more high.

In addition to Apple mobile phones, Bitcoin is another important force driving the development of PCB in 2017. Bitcoin mining has a very large demand for graphics chip cards. Relevant statistics show that for the PCB industry, the monthly demand may exceed 5 million square feet.

From the perspective of future development trends, as the pace of 5G commercialization is getting closer and closer, it is undoubtedly a new outlet for the PCB/copper clad laminate industry. According to the prediction of Essence Securities Research Center, 5G communication equipment will be the core driving force of the PCB industry in the next three years. Assuming that during the peak period of 4G and 5G construction, the total annual construction of macro base stations will be 2.3 million and 2.8 million, respectively. On the radio frequency side, the PCB market size can reach 28.8 billion a year, and the market size of high-frequency PCB boards and copper clad laminates in the 5G era will be more than 10 times that of 4G.

 

3.Seven out of ten of the global CCL output value comes from China

As an important substrate material for PCB, the development of copper clad laminates has made great progress in recent years.

From the perspective of capacity release, PCBs in 2016 showed a state of negative growth, mainly because the price of HDI boards became increasingly fierce, which intensified competition. At the same time, flexible circuit boards and packaging substrates did not achieve the expected high growth.

Despite this, the scale of global rigid copper clad laminates is constantly expanding. In 2016, the global output value of rigid copper clad laminates reached 10.123 billion U.S. dollars, an increase of 8% compared with 2015. Moreover, the growth rates of all types of rigid copper clad laminates are positive. Therefore, from the perspective of the pressure resistance of the industry chain, the copper clad laminate industry as the upstream of the PCB has a strong voice.