Kingford offers consumer-related electronics customers a number of advantages:
A global network of facilities offering the ability to nearshore for logistics convenience or migrate products to lower cost regions for cost reduction
Ability to support manufacturing requirements over the full product lifecycle
Strong internal systems which support serialization and traceability
Centralized system for documentation control
In-house plastics injection molding capability
Cable/harness assembly expertise
Electromechanical assembly expertise
Extensive test capability (AOI, x-ray, ICT, functional and burn-in/ESS)
GPS/RF test expertise
Product expertise includes:
Battery back-up sump pumps
Relevant Certifications ISO 9001:2008 (all facilities)
Ability to support third-party qualification efforts such as UL and CSA
• The size of the patch PCB is: L50MM*W50MM----L510MM*W460MM.
• The minimum size spacing of BGA patch is 0.3MM, and the solder ball is 0.2MM.
• IC minimum pitch is 0.3MM.
• SMD minimum material is 0201.