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KINGFORD PCB ELECTRONICS CO.,LTD
Office address:Unit 1001, Chuangye Building, 8-28 Centre Road, Shajing, Shenzhen, China
Tel:0086-755-23287851 Fax:0086-755-29541190
E-mail:sales@kingfordpcb.com URL:Http://www.kingfordpcb.com
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General Information

Unit

Current

2018

2019

Multilayer Max Layer Count

20

30

40

HDI Any Layer (ELIC) Max. layer count

10

12

14

Halogen Base Material

 

Tg 130,Tg 150,Tg 170

Halogen Free Base Material

 

Tg150

Tg150

Tg150,Tg170

Minimum Core Thickness

mm

0.05

0.05

0.05

Minimum Dielectric Thickness

mm

0.05

0.05

0.04

Maximum Finished Board Thickness

mm

3.5

5

6

Max Shipping panel Size (Width x Length)

mm

600x500

600x500

600x650

Max Working Panel Size (Width x Length)

mm

(Inch)

622x546

(24.5x21.5)

635x597

25x23.5

622x726

24.5*28.6

Drilled Through Hole / Drilled Via

 

 

Minimum Drilled Through-Hole Diameter

mm

0.15

0.15

0.15

Aspect Ratio

8:1

10:1

12:1

Via In Pad Plated Over (VIP)

YES

YES

YES

Laser U-Via

 

 

Minimum Laser Via Diameter

mm

0.076

0.063

0.05

Aspect Ratio

0.7:1

0.6:1

0.5:1

Copper Fill Via

YES

YES

YES

HDI Stacked Via

YES

YES

YES

Inner Layer Minimum Trace Width & Space

Unit

Current

2014

2015

Base Copper 9um

um

(mil)

-

38/38

(1.5/1.5)

38/38

(1.5/1.5)

Base Copper 12um

um

(mil)

50/50

(2/2)

50/45

(2/1.8)

45/45

(1.8/1.8)

Base Copper 17um

um

(mil)

60/60

(2.4/2.4)

60/50

(2.4/2)

50/50

(2/2)

 Base Copper 35um

um

(mil)

76/76

(3/3)

76/60

(3/2.4)

60/60

(2.4/2.4)

 Base Copper 70um

um

(mil)

127/127

(5/5)

114/100

(4.5/4)

100/100

(4/4)

 Base Copper 105um

um

(mil)

150/150

(6/6)

140/127

(5.5/5)

127/127

(5/5)

 Base Copper 210um

um

(mil)

305/305

(12/12)

280/280

(11/11)

250/250

(10/10)

Outer Layer Minimum Trace Width & Space

 

 

Base Copper 8um + plating surface copper 15um

um

(mil)

50/50

(2/2)

50/45

(2/1.8)

45/45

(1.8/1.8)

Base Copper 8um + plating surface copper 20um

um

(mil)

60/60

(2.4/2.4)

60/50

(2.4/2)

50/50

(2/2)

Base Copper 12um + plating surface copper 25um

um

(mil)

76/76

(3/3)

76/60

(3/2.4)

60/60

(2.4/2.4)

 Base Copper 17um + plating surface copper 30um

um

(mil)

100/100

(4/4)

100/90

(4/3.5)

90/90

(3.5/3.5)

 Base Copper 35um+ plating surface  copper 35um

um

(mil)

127/127

(5/5)

127/100

(5/4)

100/100

(4/4)

Base Copper 70um+ plating surface  copper 35um

um

(mil)

150/150

(6/6)

140/127

(5.5/5)

127/127

(5/5)

Min. SMD&BGA  PAD Pitch

um

(mil)

400

(16)

350

(14)

350

(14)

Minimum Board Thickness/Stackup

Unit

Current

2014

2015

2 Layers

mm

0.4

0.3

0.2

4 Layers

mm

0.5

0.4

0.3

6 Layers

mm

0.6

0.5

0.4

Impedance Control

 

 

 

 

Trace width 5mil

ohm

+/-9%

+/-8%

+/-7%

Trace width 4mil

ohm

 

+/- 10%

+/- 9%

+/- 8%

Trace width 3mil

ohm

+/-15%

+/-12%

+/-10%